Digital Library of the Silesian University of Technology contains 74 550 digital objects
Object
Title: Thermal conductivity of the epoxy resin filled by low melting point alloy
Format:
Resource Identifier:
Baza Wiedzy PŚ ; oai:delibra.bg.polsl.pl:30667
Source:
Archives of Materials Science and Engineering, 2013, Vol. 61, Iss. 1, p. 22-29
Language:
Relation:
Wydział Mechaniczny Technologiczny. Politechnika Śląska
Access:
Source of funding:
UDA-RPSL.01.03.00-00-042/12-00
Object collections:
- Digital Library > COLLECTIONS OF PUBLICATIONS OF THE SILESIAN UNIVERSITY OF TECHNOLOGY > Publications from database "Bibliography of scientific publications of Silesian University of Technology"
Last modified:
Oct 22, 2015
In our library since:
Oct 22, 2015
Number of object content hits:
52
All available object's versions:
https://delibra.bg.polsl.pl/publication/34508
Show description in RDF format:
Show description in OAI-PMH format:
| Edition name | Date |
|---|---|
| Wierzbicki, Łukasz ; Pusz, Andrzej : Thermal conductivity of the epoxy resin filled by low melting point alloy | Oct 22, 2015 |
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